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-看了Si-on-金剛石的用戶又看了
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Si-on-金剛石
基于鍵合技術實現了金剛石基硅復合襯底,有望解決高功率密度硅器件散熱能力不足的難題
Based on the bonding technology, Si-on-diamond substrate has been realized, which is expected to solve the problem of insufficient heat dissipation of Si devices with high power density.
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